Shaanxi Peakrise Metal Co.,Ltd
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Molybdenum Copper Alloy Rod MoCu25 Diameter 25mm
1.Product Description of Molybdenum Copper Alloy Rod:
The excellent thermal conductivity of molybdenum-copper alloy makes it a suitable material for use as a heat sink. While the two alloys' characteristics are comparable, molybdenum-copper alloy has a lower density than tungsten-copper alloy. The preparation of molybdenum-copper alloy is mainly by dipping method, using high-quality molybdenum powder and oxygen-free copper powder, and applying isostatic pressing (high temperature sintering-copper infiltration), with fine structure, good arc breaking performance, good electrical conductivity and thermal conductivity. Well, there is little thermal expansion.
2.Chemical composition of Molybdenum Copper Alloy Rod:
| Alloy grade | Cu | Mo | Total of impurity elements |
| MoCu10 | 10+/-2 | remain | ≤0.1 |
| MoCu15 | 15+/-3 | remain | ≤0.1 |
| MoCu20 | 20+/-3 | remain | ≤0.1 |
| MoCu25 | 25+/-3 | remain | ≤0.1 |
| MoCu40 | 40+/-5 | remain | ≤0.1 |
3.Related parameters of Molybdenum Copper Alloy Rod:
| Alloy grade | MoCu10 | MoCu15 | MoCu20 | MoCu25 | MoCu40 |
| Thermal conductivity | ≥150 | ≥160 | ≥170 | ≥180 | |
| Thermal expansion rate | 5.6+/-1.5 | 6.7+/-1.5 | 7.4+/-1.5 | 7.9+/-2 | 8.0+/-3 |
| Alloy grade | MoCu10 | MoCu15 | MoCu20 | MoCu25 | MoCu40 |
| Density | ≥9.91 | ≥9.83 | ≥9.75 | ≥9.70 | ≥9.3 |
4.Surface quality of Molybdenum Copper Alloy Rod:
The surface of the molybdenum-copper alloy rod is turned without defects such as holes, cracks, delaminations or inclusions. The defects and allowable deviations of the molybdenum-copper alloy rods are in accordance with the following table.
| Diameter | Length | ||
| diameter range | tolerance | Length range |
tolerance |
| 10<Φ≤25 | +/-0.5 | 100<Φ≤200 | +/-5 |
5.Application of Molybdenum Copper Alloy Rod:
Molybdenum-copper alloy rods for manufacturing military high-power microelectronic devices as heat sink sealing materials and aluminum oxide ceramic sealing and structural materials, also suitable for high thermal conductivity constant expansion sealing heat sinks in the manufacture of civil high-power microelectronic devices Molybdenum copper alloy rod.
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